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| SP8T Antenna Switch for GSM/UMTS CXG1228XR Description The CXG1228XR is a high power SP8T antenna switch for GSM/UMTS applications. The low insertion loss on transmit means increased talk time as the Tx power amplifier can be operated at a lower output level. On chip logic reduces component count and simplifies PCB layout by allowing direct connection of the switch to digital baseband control lines with CMOS logic levels. It requires 3 CMOS control lines. The Sony GaAs JPHEMT MMIC process is used for low insertion loss. (Applications: GSM/UMTS dual-mode handsets) Features Insertion loss (Tx1) 0.35dB (Typ.) @34dBm (GSM 900) Package Small and low height package size: 20-pin XQFN (2.7mm x 2.7mm x 0.4mm (Max.)) Structure GaAs JPHEMT MMIC This IC is ESD sensitive device. Special handling precautions are required. The actual ESD test data will be available later. -1- E06438-CR CXG1228XR Absolute Maximum Ratings (Ta = 25C) Bias voltage Control voltage Input power max. (Tx1) Input power max. (Tx2) Input power max. (UMTS1, UMTS2) Input power max. (all_Rx) Operating temperature Storage temperature VDD Vctl 7 5 36 34 32 13 - 35 to + 85 - 65 to + 150 V V dBm (Duty cycle = 12.5 to 50%) dBm (Duty cycle = 12.5 to 50%) dBm dBm C C -2- CXG1228XR Block Diagram F9 Tx2 F2 Tx1 F1 F8 UMTS2 F16 F17 UMTS1 F7 F15 F4 Ant Rx4 (GSM900) F11 F14 F5 Rx3 (GSM1800) F12 F6 Rx2 (GSM1900) F13 F3 F10 Rx1 (GSM850) -3- CXG1228XR Pin Configuration UMTS2 GND Tx1 GND 7 10 GND UMTS1 GND Ant GND 11 12 13 14 15 16 VDD 9 8 Tx2 6 5 4 3 2 1 GND Rx1 Rx2 Rx3 Rx4 20 GND 17 CTLA 18 CTLB 19 CTLC Truth Table CTL ABC Mode Tx1 GSM850/900 F1 F2 F3 F4 F5 F6 F7 F8 F9 F10 F11 F12 F13 F14 F15 F16 F17 H H L ON OFF OFF OFF OFF OFF OFF OFF ON ON ON ON ON OFF ON OFF ON Tx2 H L L OFF ON OFF OFF OFF OFF OFF ON OFF ON ON ON ON OFF ON OFF ON GSM1800/1900 Rx1 GSM850 Rx2 GSM1900 Rx3 GSM1800 Rx4 GSM900 UMTS1 UMTS2 L L L OFF OFF ON OFF OFF OFF OFF ON ON OFF ON ON ON ON ON OFF ON L H L OFF OFF OFF OFF OFF ON OFF ON ON ON ON ON OFF ON ON OFF ON L H H OFF OFF OFF OFF ON OFF OFF ON ON ON ON OFF ON ON ON OFF ON L L H OFF OFF OFF ON OFF OFF OFF ON ON ON OFF ON ON ON ON OFF ON H L H OFF OFF OFF OFF OFF OFF ON ON ON ON ON ON ON OFF OFF OFF ON H H H OFF OFF OFF OFF OFF OFF OFF ON ON ON ON ON ON OFF ON ON OFF DC Bias Condition (Ta = - 35C to + 85C) Item Vctl (H) Vctl (L) VDD Min. 2.0 0 2.8 Typ. 2.8 -- -- Max. 3.6 0.4 3.6 Unit V V V -4- CXG1228XR Electrical Characteristics (Ta = 25C) Item Insertion loss Symbol IL Port ANT - Tx1 ANT - Tx2 ANT - Rx1 ANT - Rx2 ANT - Rx3 ANT - Rx4 ANT - UMTS1 ANT - UMTS2 Isolation ISO. ANT - Rx1 ANT - Rx2 ANT - Rx3 ANT - Rx4 ANT - Tx2 ANT - UMTS1 ANT - UMTS2 ANT - Rx1 ANT - Rx2 ANT - Rx3 ANT - Rx4 ANT - Tx1 ANT - UMTS1 ANT - UMTS2 ANT - Rx1 ANT - Rx2 ANT - Rx3 ANT - Rx4 ANT - Tx1 ANT - Tx2 ANT - UMTS2 ANT - Rx1 ANT - Rx2 ANT - Rx3 ANT - Rx4 ANT - Tx1 ANT - Tx2 ANT - UMTS1 Tx1 - Rx1 Tx1 - Rx2 Tx1 - Rx3 Tx1 - Rx4 Tx2 - Rx1 Tx2 - Rx2 Tx2 - Rx3 Tx2 - Rx4 Condition *1 *2 *3, *4 *5, *6 *5, *6 *3, *4 *7 *8 *7 *8 Min. *1 *2 UMTS1 UMTS2 *1 *2 30 30 30 30 34 24 30 20 22 26 25 22 20 27 25 28 28 30 20 28 22 25 27 29 30 20 30 17 28 30 32 35 20 20 25 25 Typ. 0.35 0.50 0.78 1.10 1.10 0.78 0.52 0.60 0.48 0.53 36 36 36 36 40 29 36 25 28 30 30 27 25 32 33 35 35 37 23 35 27 30 32 34 35 26 36 20 33 35 37 40 23 26 29 31 Max. 0.50 0.65 0.93 1.25 1.25 0.93 0.67 0.75 0.63 0.68 Unit dB dB -5- CXG1228XR Item VSWR Harmonics* Control current Supply current Switching speed Symbol VSWR 2fo 3fo 2fo 3fo 2fo 3fo 2fo 3fo Ictl Idd Swt Port ANT - Tx1 ANT - Tx2 ANT - UMTS1 ANT - UMTS2 *1 Condition Min. *2 *7 *7 Vctl = 2.8V VDD = 2.8V VDD = 2.8V Vctl = 2.8V Typ. 1.20 - 43 - 33 - 36 - 33 - 45 - 42 - 47 - 43 25 0.30 5 Max. - 39 - 30 - 32 - 29 - 41 - 38 - 43 - 39 45 0.45 8 Unit -- dBm A mA S Note) Electrical Characteristics are measured with all RF ports terminated in 50. * Harmonics measured with Tx inputs harmonically matched. The use of harmonic matching is recommended to ensure optimum performance. *1 *2 *3 *4 *5 *6 *7 *8 Power incident on Tx1, Pin = 34dBm, 824 to 915MHz, VDD = 2.8V, Tx1 enabled Power incident on Tx2, Pin = 32dBm, 1710 to 1910MHz, VDD = 2.8V, Tx2 enabled Power incident on Ant, Pin = 10dBm, 869 to 894MHz, VDD = 2.8V, Rx1 or Rx4 enabled Power incident on Ant, Pin = 10dBm, 925 to 960MHz, VDD = 2.8V, Rx1 or Rx4 enabled Power incident on Ant, Pin = 10dBm, 1805 to 1880MHz, VDD = 2.8V, Rx2 or Rx3 enabled Power incident on Ant, Pin = 10dBm, 1930 to 1990MHz, VDD = 2.8V, Rx2 or Rx3 enabled Power incident on UMTS1 or UMTS2, Pin = 26dBm, 1920 to 1980MHz, VDD = 2.8V, UMTS1 or UMTS2 enabled Power incident on Ant, Pin = 10dBm, 2110 to 2170MHz, VDD = 2.8V, UMTS1 or UMTS2 enabled -6- CXG1228XR Recommended Circuit UMTS2 Tx1 Tx2 CRF (33pF) CRF (56pF) CRF (33pF) 10 UMTS1 (33pF) 12 ANT CRF (56pF) CRF 9 8 7 6 5 4 3 2 1 CRF (56pF) CRF (33pF) CRF (33pF) CRF (56pF) 11 Rx1 Rx2 Rx3 Rx4 13 14 15 16 17 18 19 20 VDD CTLA Rctl (1k) Cbypass (100pF) ( ( ) Cbypass (100pF) CTLB Rctl (1k) Cbypass (100pF) Rctl (1k) ) Cbypass (100pF) CTLC When using this IC, the following external components should be used: Rctl: This resistor is used to improve ESD performance.1K is recommended. CRF: This capacitor is used for RF decoupling and must be used for all applications. Cbypass: This capacitor is used for DC line filtering.100pF is recommended. -7- ( ) CXG1228XR Package Outline (Unit: mm) 20 PIN XQFN (PLASTIC) x4 0.05 0.35 0.05 S A-B C 0.4 0.1 2.7 C 15 16 2.7 11 A B 20 1 5 6 26 0. 0.4 PIN 1 INDEX 0.18 0.25 0.05 S 0.07 A-B C S MAX0.02 Solder Plating 0.14 - 0.03 + 0.09 0.09 0.25 +0.03 - S 0.05 S TERMINAL SECTION PACKAGE STRUCTURE Note : Cutting burr of lead are 0.05mm MAX. PACKAGE MATERIAL SONY CODE JEITA CODE JEDEC CODE XQFN-2OP-01 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.01g LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL SOLDER COMPOSITION PLATING THICKNESS SPEC. COPPER ALLOY Sn-Bi Bi:1-4wt% 5-18m -8- Sony Corporation |
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